The heart of the new led display technology

The heart of the new LED display technology

 

Among all the new LED display technologies, the technology of de-bracketing pin-based integrated packaging lamp-drive system has a core position.

 

Because it is a breakthrough in the basic underlying support technology of LED display panels, it has also been written into SLDA's T/SLDA 01-2020 group standard for the classification of Mini LED packaging technology for the first time.

 

This new system technology was first created in 2010, and two generations of technology have been developed within the framework and theoretical guidance of system technology.

 

1. The first generation of COBIP technology

 

COBIP technology is the English abbreviation of (Chip On Board Integrated Packaging), Chinese referred to as COB integrated packaging technology. It conforms to the systematic technical characteristics of de-bracket pinning, integrated packaging, and integrated panel integration of lamp drive, and is also a new system technology.

 

COBIP technology realizes the debracking pinning of the dot matrix pixel surface of the LED display panel, and integrates the traditional system technology of separating two PCB boards into one PCB board. Its great contribution to the industry lies in finding the mechanism of excessive pixel failure of LED display panels, creating a new system technology theory and the classification ideas and methods of two system technologies, and improving the level of pixel failure control of LED display panels from 10,000 to 1 million.

 

Due to the background of the times and the imbalance of industrial development, it is a pity that COBIP technology has not been able to solve the problem of excessive display system failures caused by the pins of the driver IC device on the back of the pixel plane.

Therefore, COBIP technology is only a semi-de-bracketed pinned technology, which is a dot matrix pixel chip level soldering integrated packaging technology. It only solves the problem of too many failures of the dot matrix pixel surface of the LED display panel, but does not solve the problem of too many failures of the driver IC surface.

 

In addition, in terms of the integration technology of one PCB board with the integration of lamp and driver, the layout of COBIP technology is to arrange the dot matrix pixels and driver IC devices on the same PCB board.

 

2. Second-generation COCIP and CNCIP technologies

 

COCIP and CNCIP technology are the English abbreviations of (Chip On Chip Integrated Packaging) and (Chip Next to Chip Integrated Packaging) respectively, Chinese abbreviated as COC integrated packaging and CNC integrated packaging technology. In the same way, they also conform to the systematic technical characteristics of de-bracking pinning, integrated packaging and lamp-driven integrated panel integration, and are the second-generation technologies developed within the framework of the system technology and under the guidance of the system technology theory.

 

It differs from the first generation of COBIP technology in the following aspects:

 

Double-sided de-bracking pinning of the same PCB board has been realized.

 

The dual-function fully bare die-level chip soldering integrated packaging technology has been realized.

 

It realizes the layout of the same pixel with the same surface and dot matrix of the LED display panel, and there is no driver IC device after the LED display panel.

 

That is to say, COCIP and CNCIP technology solve the problem of excessive failure of LED display panel driver IC device left by COBIP technology, which can be predicted to greatly improve the reliability of the entire LED display system. In addition, the second-generation technology can also greatly improve the optical consistency of LED display panels. From the hardware aspect, the dynamic response speed of video signal processing can be significantly improved and the delay can be reduced. The heat distribution of LED display panels is realized.